CVE-2017-17282
Low
Description
SCCP (Signalling Connection Control Part) module in Huawei DP300 V500R002C00, RP200 V500R002C00, V600R006C00, TE30 V100R001C10, V500R002C00, V600R006C00, TE40 V500R002C00, V600R006C00, TE50 V500R002C00, V600R006C00, TE60 V100R001C10, V500R002C00, V600R006C00 has a buffer overflow vulnerability. An attacker has to find a way to send malformed packets to the affected products repeatedly. Due to insufficient input validation, successful exploit may cause some service abnormal.
SeverityLow
CVSS3.1
Exploit probability—
ProductHuawei Dp300 Firmware
PublishedMar 9, 2018
First seenMar 9, 2018
How to fix
Sources list no fixed version or patch link for this vulnerability.
Affected products
| Product | Affected versions | Fixed in |
|---|---|---|
| huawei dp300_firmware | v500r002c00 | — |
| huawei rp200_firmware | v500r002c00, v600r006c00 | — |
| huawei te30_firmware | v100r001c10, v500r002c00, v600r006c00 | — |
| huawei te40_firmware | v500r002c00, v600r006c00 | — |
| huawei te50_firmware | v500r002c00, v600r006c00 | — |
| huawei te60_firmware | v100r001c10, v500r002c00, v600r006c00 | — |
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